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Advanced packaging



Tesidi can provide TSV, TGV, WLP, PLP, SIP and other advanced packaging processes wafer thinning, wafer CMP, board level thinning, board level CMP equipment and process solutions



Anhui Heyuan Power Technology Co.,Ltd All rights reserved disclaimer Anhui ICP License No. 18006884-1Technical support：IBW(www.ibw.cn)

Address: No. 73, Zhongnan Hi-Tech Hechao Intelligent Manufacturing Industrial Park, Chaohu City, Hefei City

Tel: 0551-63366816 / 138 6619 3387     Email: heypowercwh@gmail.com     Business license

138-6619-3387
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