Semiconductor devices_Anhui Heyuan Power Technology Co.,Ltd

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semiconductor substrate

Semiconductor devices

Wafer manufacturing

Advanced packaging

Semiconductor devices

Tesidi can provide equipment and process solutions for thinning, grinding, polishing, and waxing of various semiconductor device wafers.

Address: No. 73, Zhongnan Hi-Tech Hechao Intelligent Manufacturing Industrial Park, Chaohu City, Hefei City

Tel: 0551-63366816 / 138 6619 3387 Email: heypowercwh@gmail.com Business license

138-6619-3387

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