Semiconductor devices_Anhui Heyuan Power Technology Co.,Ltd

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Application areas

semiconductor substrate

Semiconductor devices

Wafer manufacturing

Advanced packaging

Semiconductor devices

Tesidi can provide equipment and process solutions for thinning, grinding, polishing, and waxing of various semiconductor device wafers.

Address: No. 73, Zhongnan Hi-Tech Hechao Intelligent Manufacturing Industrial Park, Chaohu City, Hefei City

Tel: 0551-63366816 / 138 6619 3387 Email: heypowercwh@gmail.com Business license

138-6619-3387

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