Advanced packaging_Anhui Heyuan Power Technology Co.,Ltd

Today is 2026-04-14 Tuesday，Welcome to this site

138-6619-3387Add to favorites Site Map

Touch

mobile station

Home > Application areas > Advanced packaging

Application areas

semiconductor substrate

Semiconductor devices

Wafer manufacturing

Advanced packaging

More classification

Advanced packaging

Tesidi can provide TSV, TGV, WLP, PLP, SIP and other advanced packaging processes wafer thinning, wafer CMP, board level thinning, board level CMP equipment and process solutions

Address: No. 73, Zhongnan Hi-Tech Hechao Intelligent Manufacturing Industrial Park, Chaohu City, Hefei City

Tel: 0551-63366816 / 138 6619 3387 Email: heypowercwh@gmail.com Business license

138-6619-3387

[Upward]